Two-Part Gap Filler

The SARCON® LG Series is the perfect solution for filling large, complex and uneven gaps between heat generating components that depend on reliable contact with a heat spreader to maintain optimal performance.

SARCON® LG23A and LG30A easily dispense in a liquid form that will cure at room temperature or can be dramatically accelerated with exposure to temperatures up to 100°. The mixed components cure into a flexible gel that is highly thermally conductive while exhibiting extremely low stress on delicate board components. Once cured the materials deliver a thermal conductivity of 2.3 and 3.0 W/m°K respectively.

LG Series materials are available in cartridges, pails and drums allowing them to be applied by hand or automated dispensers.

RECOMMENDED APPLICATION:

Since it is a two component curing type, it flows while absorbing gaps when uncured, and after curing it cures following the irregularities, demonstrating high adhesion and excellent heat transfer effect.

• Low repulsion load (stress) protects electronic components and boards from
  vibration and shock.
• Maintains excellent properties such as heat resistance, cold resistance and
  electrical insulation of silicon.
• Work with a dispenser is possible.