Two-Part Gap Filler
The SARCON® LG Series is the perfect solution for filling large, complex and uneven gaps between heat generating components that depend on reliable contact with a heat spreader to maintain optimal performance.
SARCON® LG23A and LG30A easily dispense in a liquid form that will cure at room temperature or can be dramatically accelerated with exposure to temperatures up to 100°. The mixed components cure into a flexible gel that is highly thermally conductive while exhibiting extremely low stress on delicate board components. Once cured the materials deliver a thermal conductivity of 2.3 and 3.0 W/m°K respectively.
LG Series materials are available in cartridges, pails and drums allowing them to be applied by hand or automated dispensers.
Since it is a two component curing type, it flows while absorbing gaps when uncured, and after curing it cures following the irregularities, demonstrating high adhesion and excellent heat transfer effect.
- Low repulsion load (stress) protects electronic components and boards from
vibration and shock.
- Maintains excellent properties such as heat resistance, cold resistance and
electrical insulation of silicon.
- Work with a dispenser is possible.
|SARCON® LG23A||General-purpose type
Thermal Conductivity: 2.3W/m•K (ASTM D5470)
|SARCON® LG30A||Thermal Conductivity: 3.0W/m•K (ASTM D5470)|
|Physical Properties||Color||A / B||White / Yellow||Red / White||visual|
|Specific Gravity||-||2.9||3.1||JIS K6220|
|Viscosity||Pa•s||1.0(1/s)||130 / 130||150 / 150|
|A / B|
|Hardness (Cured)||Shore-OO||55||50||ASTM D2240|
|Maximum particle size||mm||0.09||0.09||-|
|Electrical Properties||Breakdown Voltage||kV/mm||9||9||JIS K6249|
|Volume Resistivity||Ω•m||1x1010||1x1010||JIS K6249|
|Thermal Properties||Thermal Conductivity||W/m•K||2.3||3.0||ASTM D5470|
|Curability||Pot Life||(23°C ) min||60||60||-|
|Curing time||(23°C ) hrs||6hrs||6hrs||t=6mm 90% Cure|
|(100°C ) min||5min||10min|
To request a sample or for more information please contact email@example.com.