Sarcon® Electromagnetic Wave Absorption Type
Silicone Gap Filler Pad for Absorption of Electromagnetic Wave
Features
- Effective to absorb and damp a wide range of electromagnetic waves.
- Also effective as a high performance thermal interface material.
- Easily filling small gaps of IC chip surface with soft gel texture.
- Good workability to simply insert the product between circuit board.
- Self-adhesive gel surface does not require any adhesive tape for assembly.
- Extremely low level of low molecular siloxane.
Typical Product Properties
| Test Properties |
Unit |
EGR-11F |
Test Method |
| Physical Properties |
Thickness* |
mm |
0.5 to 1.5 |
ASTM D374 |
| Specific Gravity |
– |
3 .1 |
ASTM D792 |
| Hardness |
Shore OO |
56 |
ASTM D2240 |
| Color |
– |
Dark Gray |
Visual |
| Electrical Properties |
Volume Resistivity |
Ohm-m |
1x10 |
ASTM D257 |
| Breakdown Voltage |
V/mm |
500 |
ASTM D149 |
| Dielectric Constant |
50Hz |
28.33 |
ASTM D150 |
| 1kHz |
27.05 |
| 300kHz |
26.09 |
| Dissipation Factor |
50Hz |
0.031 |
| 1kHz |
0.02 |
| 300kHz |
0.005 |
| Thermal Properties |
Thermal Conductivity unit : W/m-K |
Hot Wire |
1 |
ASTM D2326 |
| Hot Disk |
0.8 |
ISO/CD 22007-2 |
| Recommended Operating Temp. |
?C |
-30 to +120 |
|
| ?F |
-22 to +248 |
| Flame Retardant |
– |
V-0 |
UL94 |
Compression Force unit: N/6.4cm2 (psi)
| Compression Rate |
EG-11F |
| 50EG-11F |
100EG-11F |
| 10% |
54 (12.2) |
41 (9.3) |
| 20% |
288 (65.3) |
225 (51.0) |
| 30% |
566 (128.2) |
422 (95.6) |
| 40% |
879 (199.1) |
590 (133.7) |
| 50% |
1132 (256.5) |
813 (184.2) |
| Relaxing |
846 (191.7) |
408 (92.4) |
Thermal Resistance unit: K-cm2/W (K-in2/W)
| Pressure |
EG-11F |
| 50EG-11F |
100EG-11F |
| 100kPa |
6.8 (1.05) |
9.6 (1.48) |
| 300kPa |
6.4(0.99) |
8.8 (1.36) |
| 500kPa |
6.1 (0.95) |
8.4 (1.30) |
Magnetic Characteristics
Decoupling Performance in Near Field
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