SPG-25B-NS

SPG-25B-NS Silicone-Free Compound

SARCON® Form in Place Gap Filler Type is highly conformable and high thermal conductive type silicone free compound with very low compression force. It provides a thermal solution for the recent trends of higher frequencies and integration in the development of electronic devices. SARCON® Form in Place Gap Filler Type is suitable for filling delicate gaps and still provides a superior thermal transfer.

Available in 30cc syringe or 325cc cartridge. Custom packaging available upon request. 

Recommended Applications:

• Suitable for filling delicate gaps and still provides superior thermal transfer.
• Highly conformable with very low compression forces.
• Has excellent vibration absorption capabilities.
• Maintains thermal properties across a wide temperature range.
• Can be used to "Form-In-Place" and will remain form stable.
• Requires no heat curing.
• Will not cause corrosion on any metal surface.
• Silicone free.

SPECIFICATIONS:

DURABILITY:

Thermal resistance under heat, cold, humid and thermal shock conditions.