SARCON® SPG-30B is a highly conformable/thermally conductive, high viscosity type silicone compound. It provides a thermal solution for the recent trends of integrating higher frequency electronics into smaller devices. SARCON® SPG-30B easily forms and adheres to most surfaces, shapes, and sizes of components.
SARCON® SPG-30B makes complete and reliable physical contact with the component and opposing surfaces. It provides handling properties that are superior to thermal grease & potting materials.
- Thermal transfer from heat generating device to heat spreader or heat sink.
FEATURES:
- Fill large gaps while providing superior thermal transfer.
- Conformable with very low compression forces.
- Excellent vibration absorption capabilities.
- Maintains all initial properties across a wide temperature range.
- Used to "Form-In-Place" and remain form stable.
- Requires no heat curing.
- Will not cause corrosion on any metal surface.
SPECIFICATIONS:
Property | Unit | SPG-30B | Method | |
---|---|---|---|---|
Specific Gravity | – | 3.2 | ASTM D792 | |
Viscosity | Pa•s | 2,600 | Fujipoly | |
Flow Rate | cc/min | - | Fujipoly | |
Thermal Conductivity | Watt/m•K | 3.1 | Fujipoly | |
Volume Resistivity | MΩ-m | 6.9 x 105 | ASTM D257 | |
Breakdown Voltage | kV/mm | 15 | ASTM D149 | |
Withstand Voltage | kV/mm | - | ASTM D149 | |
TGA Weight Loss | wt% | - | After +150°C, 24hrs aging |
|
Operating Temp. Range | °C | -40 to +150 | Recommended | |
Thermal Resistance | K•cm2/W | 2.1 | ASTM D5470 | |
Compression Load/Modulus |
N | Peak | - | Fujipoly |
Sustain | - |
RELIABILITY:
Thermal resistance under heat, cold, humid and thermal shock conditions.
+150°C Aging | |||||
---|---|---|---|---|---|
Gaps | Initial | 100hrs | 250hrs | 500hrs | 1,000hrs |
1.0mm | 2.1 | 2.1 | 2.2 | 2.4 | 2.6 |
+70°C & +120°CAging | |||||
---|---|---|---|---|---|
Gaps | Initial | 100hrs | 250hrs | 500hrs | 1,000hrs |
1.0mm | 2.1 | 2.1 | 2.1 | 2.1 | 2.1 |
-40°C Aging | |||||
---|---|---|---|---|---|
Gaps | Initial | 100hrs | 250hrs | 500hrs | 1,000hrs |
1.0mm | 2.1 | 2.1 | 2.1 | 2.1 | 2.1 |
+60°C 95%RH Aging | |||||
---|---|---|---|---|---|
Gaps | Initial | 100hrs | 250hrs | 500hrs | 1,000hrs |
1.0mm | 2.1 | 2.1 | 2.1 | 2.1 | 2.1 |
-40°C to +125°C Heat Shock | |||||
---|---|---|---|---|---|
Gaps | Initial | 100hrs | 250hrs | 500hrs | 1,000hrs |
1.0mm | 2.1 | 2.2 | 2.1 | 2.1 | 2.2 |
Unit of Thermal Resistance: ?C•in2/W based on ASTM D5470 Test Method.
Contact Surface: 3.14cm2 (0.49in2)
Filled SPG1-A material’s weight: 1.0mm - 09.g; 2.0mm - 1.8g; 3.0mm - 2.6g