TYPICAL CHARACTERISTICS:
Sarcon® PG45A is the lowest modulus thermal interface putty available. It is ideally suited for applications requiring low compression force on the component. The putty-like material exhibits a high thermal conductivity and low thermal resistance while conforming to even the smallest protrusions and depressions on components to make complete, reliable physical contact.
Note: Maximum recommended compression is 30%
| Test Property | Unit | Measure | Method | |
|---|---|---|---|---|
| PG45A | ||||
| Thermal Conductivity | Watt/m•K | 4.5 | Hot Disk | |
| Color | Visual | Gray | – | |
| Specific gravity | 3.0 | ASTM D 792 | ||
| Dielectric Constant | 1kHz | 7.3 | – | |
| Flammability | V-0 Equivalent | UL 94 | ||
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