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Sarcon® PG45A is the lowest modulus thermal interface putty available. It is ideally suited for applications requiring low compression force on the component. The putty-like material exhibits a high thermal conductivity and low thermal resistance while conforming to even the smallest protrusions and depressions on components to make complete, reliable physical contact.

Note: Maximum recommended compression is 30%

Test Property Unit Measure Method
Thermal Conductivity Watt/m•K 4.5 Hot Disk
Color Visual Gray
Specific gravity   3.0 ASTM D 792
Dielectric Constant 1kHz 7.3
Flammability   V-0 Equivalent UL 94

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