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Announcements

A New Thermal Interface Alternative

A New Thermal Interface Alternative

  • Posted: 25 November, 2013

Fujipoly’s Sarcon® 25GR-T2d thermal interface material is a very soft, highly conformable gap filler pad with a reinforced mesh center.

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Thermal Compound Sets New Industry Benchmark

Thermal Compound Sets New Industry Benchmark

  • Posted: 24 October, 2013

Fujipoly’s new SARCON SPG-50A sets a new performance standard for form-in-place gap filler materials by delivering a thermal conductivity of 5.0 W/m°K.

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New Gap Filler Pad Exhibits Thermal Resistance of Only .21°Cin2/W

New Gap Filler Pad Exhibits Thermal Resistance of Only .21°Cin2/W

  • Posted: 27 September, 2013

Fujipoly’s New Sarcon GR25A-0H2-30GY is a 0.3mm thick, low thermal resistance interface material with a low-tac surface on both sides. This special treatment dramatically reduces material tearing and damage during assembly and rework operations.

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New Low Resistance TIM Delivers 6.0 W/m°K Performance

New Low Resistance TIM Delivers 6.0 W/m°K Performance

  • Posted: 26 August, 2013

Fujipoly announces the introduction of Sarcon® GR45A-00 a very low modulus thermal interface material with a low thermal resistance. This new formulation completely fills air gaps between components, board protrusions and recessed areas while exhibiting very low pressure.

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A Cooling Influence on LED Lighting

A Cooling Influence on LED Lighting

  • Posted: 24 July, 2013

Over the last several years hundreds of major electronics manufacturers have expanded their use of LED lighting to enhance both product appearance and functionality.

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We Have a Winner!

We Have a Winner!

  • Posted: 19 June, 2013

Over the last several weeks, hundreds of engineers and industry professionals entered Fujipoly’s Great Gift Giveaway by filling out an online entry form that asked participants to simply name one of the Company’s products.

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New Gap Filler Pad Introduced

New Gap Filler Pad Introduced

  • Posted: 24 May, 2013

Fujipoly announces the introduction of Sarcon® GR25A-00-50GY, an extremely soft thermal gap filler pad that also exhibits a very low thermal resistance.

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Amazing Gift Giveaway

Amazing Gift Giveaway

  • Posted: 19 April, 2013

On June 7th one lucky engineer will have the option of selecting a free iPad with Retina Display, iPad mini or $500 American Express gift card by simply naming one Fujipoly thermal interface material or elastomeric connector product! Due to the limited promotion of this

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Low Resistance Gold Plated Connector

Low Resistance Gold Plated Connector

  • Posted: 28 March, 2013

Fujipoly’s Zebra® Gold Series 8000B is a high performance, low resistance connector that is capable of transferring both data and power between parallel components or circuit boards.This interconnect device is constructed from a low durometer silicone

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New Form-in-Place Thermal Compound Offers Many Advantages

New Form-in-Place Thermal Compound Offers Many Advantages

  • Posted: 4 March, 2013

Fujipoly announces the introduction of SARCON® SPG-20A, an easy to dispense, low-viscosity thermally conductive silicone compound.

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