Announcements
![New Form-in-Place Thermal Compound Offers Many Advantages](assets/images/prphotos/3.4.13.jpg)
New Form-in-Place Thermal Compound Offers Many Advantages
- Posted: 4 March, 2013
Fujipoly announces the introduction of SARCON® SPG-20A, an easy to dispense, low-viscosity thermally conductive silicone compound.
Read More![Thermal Gel Sheets](assets/images/prphotos/1.13.jpg)
Thermal Gel Sheets
- Posted: 29 January, 2013
Fujipoly announces the availability of Sarcon® 50GR-Ae, an extremely soft .5mm thick thermal interface material. The gel-like sheet compound is designed to efficiently transfer heat from its source to a nearby heat sink.
Read More![Happy Holidays!](assets/images/prphotos/12.12.jpg)
Happy Holidays!
- Posted: 13 December, 2012
Seasons Greetings to you and your family from the entire Fujipoly team! We look forward to working with you in the new year!
Read More![Cost Effective Board-Level Connector](assets/images/prphotos/11.12.jpg)
Cost Effective Board-Level Connector
- Posted: 15 November, 2012
Fujipoly’s Zebra® 2004 Elastomeric Connector provides 140 electrical connections per inch when positioned between a circuit board and a parallel electronic device such as an LCD display.
Read More![Versatile Low Hardness Sarcon Thin Film](assets/images/prphotos/9.12.jpg)
Versatile Low Hardness Sarcon Thin Film
- Posted: 24 September, 2012
Sarcon® 30QR from Fujipoly is a low hardness thermal interface material that exhibits a thermal conductivity of 1.10 W/m°K and a thermal resistance of .57 °Cin2/W.
Read More![No Solder Board-to-Board Connector](assets/images/prphotos/8.12.jpg)
No Solder Board-to-Board Connector
- Posted: 29 August, 2012
In an effort to improve the efficiency of electronic assembly operations, Fujipoly offers an interconnect device that quickly & easily mates surfaces such as a PCB to PCB or Sensor to PCB.
Read More![Thermally Conductive Thin Film](assets/images/prphotos/7.12.jpg)
Thermally Conductive Thin Film
- Posted: 25 July, 2012
Sarcon® 30HR from Fujipoly is a silicone-based thin film that exhibits a 1.7 W/m°K thermal conductivity when placed between a heat source such as a high-performance semiconductor and a nearby heatsink.
Read More![Congratulations](assets/images/prphotos/6.12.jpg)
Congratulations
- Posted: 12 June, 2012
Over the last five weeks, hundreds of engineers and industry professionals entered Fujipoly’s New iPad giveaway promotion.
Read More![Keeping It Cool](assets/images/prphotos/5.12.jpg)
Keeping It Cool
- Posted: 15 May, 2012
Fujipoly announces the availability of Sarcon® 25GR-T2d, a very soft highly conformable thermal interface medium that is suited for both low and high-volume production applications.
Read More![iPad3 Giveaway](assets/images/prphotos/4.12.jpg)
iPad3 Giveaway
- Posted: 17 April, 2012
Since the highly anticipated release of the iPad3 last month, millions of tech junkies have been boasting about the amazing new Retina Display and updated A5X processor.
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